Heavy Copper Dry Film Photoresist HC-1538

Product Overview

HC-1538 is a dry film photoresist designed for heavy copper and copper plating applications. It provides strong adhesion, high resolution, and good resistance during copper plating processes, helping maintain pattern integrity and imaging quality throughout PCB manufacturing. The water-soluble development system supports efficient and clean processing.

Technical Specifications

PropertiesParameters
Thickness38um
Exposure Energy(SST=7/21)40mJ/cm2
Sensitivity (21ST)7土1
Resolution(SST=6/21)45um
Adhesion(SST=6/21)50um
Stripping Time (3%NaOH, 50° C)60s

Key Features

High Resolution：
Supports fine-line pattern formation for flexible PCB and high-density circuit applications.

Excellent Photosensitivity：
Provides consistent exposure performance for reliable image transfer during PCB manufacturing.

Strong Adhesion：
Provides good adhesion to the substrate, helping maintain pattern integrity during processing.

Fast Exposure Response：
Supports efficient exposure processes and stable production performance.

Water-Soluble Development：
Designed for water-soluble development with clean and efficient processing.